Vacuum Plasma Spray (VPS)

Vacuum Plasma Spray (VPS), also referred to as Low-Pressure Plasma Spray (LPPS), employs a high-enthalpy plasma jet generated in a manner analogous to the Atmospheric Plasma Spray (APS) process. However, in contrast to APS, coating deposition is executed within a hermetically sealed vacuum chamber under controlled low-pressure conditions. The requisite vacuum level is achieved via a dedicated pump system, which evacuates the chamber to the specified process pressure. This environment facilitates more precise control over the plasma/substrate interaction and extends process capability.

Controlled Process Dynamics: Enables independent regulation of particle heating and particle velocity.

Advanced Material Compatibility: Permits the processing of reactive feedstock materials susceptible to atmospheric contamination, including titanium, iron-based alloys, and silicon.

Fields of Application

The VPS process is characterized by its versatility in processing a broad spectrum of coating materials. Furthermore, the ability to execute deposition across a wide range of controlled pressures directly influences the resultant coating microstructure, notably enabling the production of coatings with significantly reduced porosity and enhanced density.

CTS VP2000 Plasma System Platform

The CTS VP2000 vacuum plasma systems integrate advanced automation architectures based on Siemens TIA Portal or Mitsubishi GX Works engineering frameworks. The human-machine interface (HMI) is engineered for operational simplicity, employing an intuitive operator workflow that ensures high user acceptance from initial commissioning.

System construction adheres to current industrial safety standards. Closed-loop process control is achieved through continuous parameter monitoring via high-precision sensor arrays and controllers, providing exceptional quality assurance for your coating applications. An Advanced Remote Interface facilitates extensive bidirectional data communication between the plasma system and ancillary robotic or other multi-axis handling systems.

The VPS vacuum plasma spraying system is designed on a modular platform and is available in multiple configurations, ranging from compact R&D-scale systems to fully integrated, high-throughput production vacuum coating cells equipped with multi-spindle workpiece manipulation capabilities.

真空-等离子体喷溅(VP)

真空等离子体喷溅(VP)，也称作低压等离子体喷溅(LPP)，采用较高-热等离子体喷射产生的相类似的方式对大气层等离子体喷溅(APS)的过程。 然而，不同APS，涂层在一个密封的真空腔内控制在低压条件。 所需要的真空级是通过使用特别系统抽泵，液体推室的指定过程的压力。 这种介质有利于更精确地控制等离子衬底的相互作用和扩大的技术能力。

控制过程的动态特性：允许独立地控制加热粒子以及他们的速度。

改进的材料相容性：允许处理的化学活性原料，都受到大气污染，包括钛、铁基金和硅。

应用领域

该VP过程是多才多艺的处理范围广泛的涂层材料。 此外，能够适用于广泛范围的可调整的压力直接影响所得到的微观结构的涂层，特别是允许你得涂料显着降低的孔隙率和增加了密度。

CTS VP2000系统平台等离子体

CTS VP2000真空-等离子系统集成了先进的自动化架构的基础上，西门子TIA的门户网站或三菱GX工作的工程的平台。 人类-机器的接口(人机)设计为便于操作，使用一个操作直观的工作流程，以确保高度的用户核准从目前的初始试运行。

系统的设计符合目前工业安全标准。 闭循环过程的控制是通过连续监测参数使用高精密传感器阵列和控制器，提供卓越的品质保证为涂层的应用。 先进的远程接口，便于广泛的双向传送数据之间的等离子系统和辅助机械或其他多轴控制系统。

该VP真空-等离子体喷涂系统设计一个模块化的平台和提供各种各样的配置，从紧凑的R&D系统的全面综合的高性能的真空镀膜生产单元配备多锭坯操纵能力。